Battery Management System (BMS) chip

Up to 16-Series Li-Battery Cell Packs

CRX5116A Chip

  • 16-cell battery monitoring with safety protection function
  • Built-in high-side NMOS driver
  • Fuse blow function
  • Supports 9 temperature sensors
  • 18-bit precision ADC
  • <1 mΩ coulomb counter
  • Autonomous safety detection
  • Ultra-low quiescent power consumption
  • Integrated passive cell balancing
  • 5-LED driver
  • Ideal for home energy storage and electric vehicle applications

Technical comparative analysis of products similar to CRX5116A

Market Equivalent

CRX 5116ABQ769xx
Features64-pin compatible with 48-pin design
9 dedicated temperature sensor interfaces, NMOS switch driver, fuse blow driver, built-in passive cell balancing, 5-LED driver, autonomous safety diagnostics, Coulomb counter, I²C/SPI communication
Comprehensive BMS functionality with enhanced scalability and future-proof design
48-pin supports 16S cell design
3 temperature sensor interfaces, NMOS switch driver, fuse blow driver, built-in passive cell balancing, no LED driver, autonomous safety diagnostics, Coulomb counter, OTP configuration interface
Performance18-bit precision ADC
Higher accuracy with more temperature sensors
Supports <1mΩ Coulomb counter
Enhanced core capabilities
16-bit precision ADC
Pin-multiplexed temperature sensors compromise accuracy
Supports <1mΩ Coulomb counter
CostSMIC 180nm BCD process technologyUS-based chip fabrication and packaging
Applications
Full compatibility with 16-48V systems: Home ESS, e-bikes, vacuum cleaners, power tools
12-48V compatible systems with identical application scenarios
Client BenefitsChip wake-up time <10ms
More accurate multi-sensor thermal monitoring
Eliminates client-side OTP programming
Dedicated communication chip selection pin for multi-BMS scenarios
Simplified deployment with lower total cost
Hot-swappable and sequence-free assembly
Wake-up time 10ms-2s
Requires external compensation circuits for thermal sensing
Mandatory client-side configuration programming
Requires external components for multi-chip communication
Manufacturing100% domestic production (China)USA

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